
uMCP

SK Hynix uMCP
UFS3.1+LPDDR5
Latest UFS NAND and LPDDR DRAM stacked in a single package
High-performance mobile solution with capacity and speed
UFS2.2+LPDDR4X
UFS NAND and LPDDR DRAM stacked in a single package
Competitively thin form factor packing high densities with smaller footprint
Do you know more about SK Hynix's product uses, technical documents, and solutions related to uMCP? Then quickly get in touch with SK Hynix Distributor - NHE!
SK Hynix Featured Parts (2026/2/3):
- IC DRAM FLASH MEMORY IC
- IC DRAM FLASH MEMORY IC
- IC DRAM FLASH MEMORY IC
- IC DRAM FLASH MEMORY IC
- IC DRAM FLASH MEMORY IC
- IC DRAM FLASH MEMORY IC
- IC DRAM FLASH MEMORY IC
- IC DRAM FLASH MEMORY IC
- IC DRAM FLASH MEMORY IC
- IC DRAM FLASH MEMORY IC
- IC DRAM FLASH MEMORY IC
- IC DRAM FLASH MEMORY IC
SK Hynix Latest News:
- SK hynix Starts Mass Production of 1anm DRAM Using EUV Equipment
- SK hynix Develops World’s Fastest Mobile DRAM LPDDR5T
- SK hynix announced that it has started the full-scale mass-production of high-speed DRAM HBM2E
- SK hynix announced to launch world’s first DDR5 DRAM
- SK hynix would acquire Intel’s NAND memory and storage business for US $9 billion
- SK hynix announced the completion of developing the industry’s most multilayered 176-layer 512 Gb Tr
- SK hynix announced that it has started mass-production of 18GB (gigabyte) LPDDR5 mobile DRAM
- SK hynix announced that it has started mass production of the 8 Gb LPDDR4 mobile DRAM based on the 1
- SK hynix Starts Mass-production of LPDDR5 Mobile DRAM with Industry’s Largest Capacity
- SK hynix Obtains Industry’s First Validation for 1anm DDR5 DRAM on the 4th Gen Intel® Xeon® Scalab
- SK hynix Develops MCR DIMM – World’s Fastest Server Memory Module
- SK hynix Develops World’s Highest 238-Layer 4D NAND Flash

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